Solder joint

ANSYS SOLDER JOINT RELIABILITY SIMULATION SOLUTIONS

In today’s competitive business environment balancing the conflicting demands of miniaturization, performance and efficiency are paramount. In demanding Ball Grid Array (BGA) applications, the solder joints are a primary point of failure. With the advent of 2.5D packaging and beyond, the number of joints and bumps are under greater and newer stresses than ever. For maintaining a technology lead in today’s economic climate, simulation is more crucial than ever. The modern BGA design will need to evaluate cyclic fatigue, thermal stress/performance, drop test and even electromigration early on in the design process to keep up.

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