Ansys Q3D Extractor

Accurate 3D Extraction of Electrical Parameters

Advanced Electromagnetic Extraction for Interconnects and Packages

Ansys Q3D Extractor is a specialized simulation tool for extracting parasitic electrical parameters—resistance (R), inductance (L), capacitance (C), and conductance (G)—from interconnects, PCBs, IC packages, and connectors. It enables engineers to analyze signal and power behavior in high-speed and high-frequency systems, ensuring optimal performance, reduced EMI, and reliable electronic designs.

Overview of Ansys Q3D Extractor

Q3D Extractor provides engineers with a robust platform for full 3D electromagnetic field simulation focused on interconnect parasitics. It accurately calculates R, L, C, and G matrices for conductors, traces, vias, and packages, which can be used in circuit, SI, and PI simulations. Its multiphysics capabilities enable coupling with thermal and structural simulations to optimize electronic designs.

What’s in it for Engineers

Accurate Power Delivery Simulations:
Q3D specializes in power delivery network (PDN) simulations, helping engineers design circuits and interconnects for high-frequency and high-speed applications where signal integrity and power delivery are crucial.

Optimization of Electromagnetic and Thermal Coupling:
Engineers can optimize electromagnetic shielding and thermal management in sensitive devices, ensuring that electrical components stay cool and free from interference.
Power Integrity for Complex Devices:
Q3D ensures power integrity across complex integrated circuits and PCBs, ensuring the stability and performance of power supplies in critical applications.

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Featured Applications 

Ansys Q3D Extractor is a powerful tool for extracting electromagnetic parameters from 3D models, essential for designing high-frequency electrical systems like PCBs, connectors, and packaging. Here are 10 key applications for Ansys Q3D Extractor with concise descriptions:

PCB Design & Analysis

Signal Integrity: Extract parasitic inductance, capacitance, and resistance to ensure optimal signal integrity.

Trace Impedance Calculation: Analyze trace impedance and design controlled impedance for high-speed PCBs.

Interconnect Analysis: Evaluate the performance of PCB interconnects and vias in high-frequency circuits.

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Package & Connector Modeling

Connector Simulation: Model and extract parameters for connectors and packaging to optimize performance.

Signal Integrity in Connectors: Analyze how connectors impact signal integrity at high frequencies.

Package Design Optimization: Improve the design of RF and microwave packages for minimal signal loss.

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Electromagnetic Field Extraction

Field Calculation: Extract electromagnetic field parameters for complex 3D structures.

Coupling Effects: Evaluate the coupling effects between traces, vias, and other components.

Radiation Analysis: Assess the radiation patterns of devices, ensuring compliance with EMI standards.

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High-Speed Interconnect Simulation

Via Modeling: Extract via inductance, capacitance, and resistance to model interconnects accurately.

High-Speed Performance: Analyze high-speed interconnects and optimize them for minimal crosstalk and loss.

Package Parasitics: Evaluate parasitic effects of package leads and pins in high-speed applications.

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3D Extraction for Multi-Layer PCBs

Multi-Layer Modeling: Extract parasitics in multi-layer PCB designs to ensure high-frequency performance.

Stackup Optimization: Optimize the PCB stack-up for minimum interference and cross-talk.

Thermal Effects: Simulate thermal effects on multi-layer designs to prevent overheating.

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Power Integrity & Grounding

Power Delivery Networks (PDN): Extract impedance and inductance of power delivery networks to ensure efficient power distribution.

Grounding Optimization: Model and optimize grounding systems to minimize noise and voltage fluctuations.

Decoupling Capacitors: Analyze and optimize decoupling capacitor placement for stable power delivery.

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EMI/EMC Compliance

Electromagnetic Interference: Simulate EMI and extract parameters to reduce electromagnetic interference in electronic systems.

Shielding Effectiveness: Evaluate the effectiveness of electromagnetic shielding in devices.

EMC Compliance: Ensure devices meet electromagnetic compatibility (EMC) standards to reduce noise.

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RF & Microwave System Design

Impedance Matching: Extract parameters to optimize impedance matching in RF and microwave systems.

Transmission Line Design: Analyze transmission lines to reduce loss and signal degradation in high-frequency circuits.

Antenna Optimization: Model antenna parameters and optimize designs for improved performance.

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High-Frequency Device Simulation

Device Performance: Extract parasitics and simulate the performance of high-frequency devices like filters, amplifiers, and switches.

Load & Source Simulation: Model device loading and sources in high-frequency applications to optimize performance.

Miniaturization: Simulate compact designs while maintaining performance in high-frequency devices.

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Automotive & Aerospace Applications

Automotive Electronics: Optimize PCBs and interconnects for automotive electronics with a focus on high-frequency applications.

Aerospace Systems: Design and analyze electromagnetic behavior in aerospace systems, ensuring reliability at high frequencies.

Antenna Systems for Aerospace: Optimize antenna designs for aerospace communication systems to ensure effective signal transmission.

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Relevant FAQs 

Does Q3D Extractor support 3D full-wave simulations? +

Yes, it supports 3D full-wave electromagnetic field extraction for high-frequency designs.

Can Q3D Extractor analyze signal integrity? +

Yes, it simulates high-speed signals and ensures integrity in interconnects and PCBs.

How does Q3D Extractor handle parasitic extraction? +

It provides accurate parasitic extraction for capacitive, inductive, and resistive elements in circuit designs

Can Q3D Extractor be used for complex PCB designs? +

Yes, it is ideal for simulating complex PCB geometries and high-frequency components.

Does Q3D Extractor support impedance analysis? +

Yes, it calculates the impedance and propagation characteristics of interconnects and transmission lines.

Can Q3D Extractor handle large-scale projects? +

Yes, it efficiently simulates large-scale designs and extracts parasitic data for complex systems.

Does Q3D Extractor integrate with Ansys HFSS? +

Yes, it integrates with HFSS to simulate the entire electromagnetic environment of the PCB.

Which industries benefit most from Q3D Extractor? +

Telecommunications, automotive, consumer electronics, aerospace, and industrial electronics.

Can it handle high-speed digital systems? +

Yes. Q3D Extractor is optimized for high-speed buses, differential pairs, and memory interfaces

Can Q3D Extractor integrate with SIWave and HFSS? +

Yes. Extracted parasitics can be used in Ansys SIWave, HFSS, and circuit simulations.

Ready to unlock the full potential of Ansys Q3D Extractor?

Explore Ansys Q3D Extractor for efficient extraction of parasitics in your high-frequency, high-speed designs.

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