Electronics Cooling
Project Type: Electronics Cooling
Challenge: Component overheating in compact enclosures.
Solution: Icepak CFD analysis for thermal optimization.
Key Takeaway: Reduced component temperature and improved lifespan.
Project Type: Electronics Cooling
Challenge: Component overheating in compact enclosures.
Solution: Icepak CFD analysis for thermal optimization.
Key Takeaway: Reduced component temperature and improved lifespan.
