Project Type: Imaging system for aerospace application
Challenge: Maintaining optical alignment under thermal load
Solution: Optomechanical coupling simulation using Ansys Zemax and Mechanical
Key Takeaway: Enhanced stability and precision under harsh environmental conditions

Project Type: Photonic integrated circuit development
Challenge: Reducing signal loss and heat buildup in photonic chip
Solution: Coupled photonic-thermal simulation with Ansys Lumerical
Key Takeaway: Improved optical efficiency by 25% and reduced thermal distortion

Project Type: Automotive headlamp design
Challenge: Achieving uniform illumination with minimal glare
Solution: Optical and illumination analysis using Ansys Speos
Key Takeaway: Reduced prototyping time by 40% and achieved compliance with global lighting standards